Filetype Excel XLSX | Posted on 09 Aug 2022 | 3 years ago
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202x Filetype XLSX File size 0.18 MB Source: irds.ieee.org
Sheet 1: INDEX
| Links in this File to Tables and Notes | |
| Factory Integration | |
| Table FAC1 | Acronyms |
| Table FAC2 | Standards Important to the Factory Integration Roadmap |
| Table FAC3 | Factory Integration Difficult Challenges |
| Table FAC4 | Key Focus Areas and Issues for FI Functional Areas Beyond 2017 |
| Table FAC5 | Stabilized FI Metrics with Recommended Values (Critical but Educational Values) |
| Table FAC6 | Factory Operations Technology Requirements |
| Table FAC7 | Context Data Importance for Good Equipment Visibility |
| Table FAC8 | Production Equipment Technology Requirements |
| Table FAC9 | Material Handling Systems Technology Requirements |
| Table FAC10 | Factory Information and Control Systems Technology Requirements |
| Table FAC11 | Facilities Technology Requirements |
| Table FAC12 | Augmenting Reactive with Predictive Technology Requirements |
| Table FAC13 | Big Data Technology Requirements |
| Table FAC14 | Stabilized FI Potential Solutions with Description |
| Table FAC15 | Crosscut Issues Relating to Factory Integration |
| Printable Notes | |
| Table FAC6 notes | Explanation of Items for Factory Operations Requirements |
| Table FAC8 notes | Explanation of Items for Production Equipment Requirements |
| Table FAC9 notes | Explanation of Items for Material Handling Systems Requirements |
| Table FAC10 notes | Explanation of Items for Factory Information and Control Systems Requirements |
| Table FAC11 notes | Explanation of Items for Facilities Requirements |
| Table FAC12 notes | Explanation of Items for Augmenting Reactive with Predictive Requirements |
| Table FAC13 notes | Explanation of Items for Big Data Requirements |
| Copyright © 2018 IEEE. All rights reserved. |
| INDEX | ||||
| Table FAC-1 Acronyms | ||||
| Acronym | Meaning | Acronym | Meaning | |
| ACSEC | Advisory Committee (AC) on Information Security and Data Privacy | FDC | Fault Detection and Classification | |
| AMC | Airborne Molecular Contamination | FEP | Front end Process | |
| AMHS | Automated Material Handling System | F-GHG | fluorinated greenhouse gases | |
| APC | Advanced Process Control | FI | Factory Integration | |
| ARAMS | Automated Reliability, Availability, and Maintainability Standard | FICS | Factory Information and Control System | |
| ARP | Augmenting Reactive with Predictive | FO | Factory Operations | |
| BD | Big Data | FOUP | Front Opening Unified Pod | |
| BEP | Back End Process | FP | Fault Prediction | |
| BKMs | Best Known Methods | GEM | Generic Equipment Model | |
| CIP | Continuous Improvement Program | HSMS | High-Speed SECS Message Services | |
| CPS | Cyber-Physical System(s) | HVM | High Volume Manufacturing | |
| CPU | Central Processing Unit | I/O | Input/output | |
| CSA | Control Systems Architectures | I4.0 | Industry 4.0 | |
| CVD | Chemical Vapor Deposition | IC | Integrated Circuit | |
| DFM | Design for Manufacturing | ID | Identity | |
| DM | Data Mining | IDM | Integrated Device Manufacturer | |
| DOT | Deliver-On-Time | IFT | International Focus Team | |
| DS | Decision Support | IGPT | Insulated-Gate Bipolar Transistor | |
| EES | Extremely Electrostatic Sensitive | IM | Integrated Measurement | |
| EESM | Equipment Energy Saving Mode | iNEMI | International Electronics Manufacturing Initiative | |
| EFEM | Equipment Front-End Module | IP | Intellectual Property | |
| EFM | Electric Field Induced Migration | IRDS | International Roadmap for Devices and Systems | |
| EHM | Equipment Health Monitor | ISMI | International SEMATECH Manufacturing Initiative | |
| EMI | ElectroMagnetic Interference | ISO | International Standards Organization | |
| EOW | Equipment Output Cycle Time Waste | IT | Information Technology | |
| EPT | Equipment Performance Tracking | ITRS | International Technology Roadmap for Semiconductors | |
| ESA | Electrostatic Attracted, Electrostatic Attraction | JIT | Just-In-Time | |
| ESD | Electrostatic Discharge | LEED | Leadership in Energy and Environmental Design | |
| ESH/S | Environmental, Safety, Health, and Sustainability | LP | Low Power | |
| EUV | Extreme Ultraviolet | MES | Manufacturing Execution System | |
| EUVL | Extreme Ultraviolet Lithography | MFL | Maximum Foreseeable Loss | |
| ExD | Excursion Detection (VM capability) | MHS | Material Handling System | |
| FC | Fault Classification | NGOs | Non-Government Organizations | |
| FD | Fault Detection | NIST | National Institute of Standards and Technology | |
| NPW | Non-Product Wafer | SECS | SEMI Equipment Communication Standard | |
| NTP | Networked Time Protocol | SEM/TEM | Scanning Electron Microscopy/Transmission Electron Microscopy | |
| OEE | Overall Equipment Efficiency | SEMI | Semiconductor Equipment and Material International | |
| OEM | Original Equipment Manufacturer | SESMC | Subsystem Energy Saving Mode Communication | |
| PCL | Predictive Carrier Logistics | SFORMS | Secured Foundation of Recipe Management Systems | |
| PCS | Process Control Systems | SHL | Super Hot Lots | |
| PdM | Predictive Maintenance | SM | Smart Metrology (a VM capability), Smart Manufacturing | |
| PE | Production Equipment | SMC | Surface Molecular Contamination | |
| PFC | Perfluorocarbon | SME | Subject Matter Expertise, or Subject Matter Expert | |
| PIC | Physical Interface and Carriers | SOAP | Simple Object Access Protocol | |
| PM | Preventative Maintenance | SOS | Software as a Service | |
| POC | Point of Connection | SPC | Statistical Process Control | |
| POD | Point of Delivery | STS | need to define | |
| POE | Point of Entry | TH | Throughput | |
| POP | Point of Process | TR | Technical Requirements | |
| POS | Point of Supplier | UF | Ultra-Filtration | |
| POU | Point of Use | UPW | Ultra-Pure Water | |
| PPM | Predictive and Preventative Maintenance | VM | Virtual Metrology | |
| PTP | Precision Time Protocol | W2W | Wafer-to-Wafer (control) | |
| R&D | Research and Development | WIP | Work in Process | |
| R2R | Run-to-Run (control) | WIW | Within Wafer (control) | |
| RAM | Reliability, Availability, and Maintainability | WTW | Wait Time Waste | |
| RM | Real Metrology | XML | eXtensible Markup Language | |
| ROI | Return on Investment | YEx | Yield Excursion | |
| RUL | Remaining Useful Life | YMS | Yield Management System | |
| SCOR | Supply Chain Operations Reference | YP | Yield Prediction | |
| need to define |
| INDEX | ||
| Table FAC-2 Standards Important to the Factory Integration Roadmap | ||
| Number | Title | |
| IEST-RP-CC012.2 | Considerations in Cleanroom Design | |
| ISO 14644-1 | Cleanrooms and controlled environments, Part 1: Classification of air cleanliness | |
| SEMI E10 | Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization |
|
| SEMI E116 | Specification for Equipment Performance Tracking | |
| SEMI E120 | Specification for the Common Equipment Model | |
| SEMI E125 | Specification for Equipment Self Description | |
| SEMI E126 | Specification for Equipment Quality Information Parameters | |
| SEMI E129 | Guide to Assess and Control Electrostatic Charge in A Semiconductor Manufacturing Facility |
|
| SEMI E132 | Specification for Equipment Client Authentication | |
| SEMI E133 | Specification for Automated Process Control | |
| SEMI E134 | Specification for Data Collection Management | |
| SEMI E138 | XML Semiconductor Common Components | |
| SEMI E147 | Guide for Equipment Data Acquisition | |
| SEMI E148 | Specification for Time Synchronization and Definition of the TS-Clock Object | |
| SEMI E151 | Guide for Understanding Data qaulity | |
| SEMI E160 | Specification for Communication of Data Quality | |
| SEMI E163 | Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items Within Specially Designated Areas |
|
| SEMI E164 | Specification for EDA Common Metadata | |
| SEMI E167 | Specification for Equipment Energy Saving Mode Communications (EESM) | |
| SEMI E169 | Guide for Equipment Information System Security | |
| SEMI E170 | Specification for Secured Foundation of Recipe Management Systems (SFORMS) | |
| SEMI E171 | Specification for Predictive Carrier Logistics (PCL) | |
| SEMI E175 | Specification for Subsystem Energy Saving Mode Communication (SESMC) | |
| SEMI E176 | Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment | |
| SEMI E30 | Specification for the Generic Model for communications and Control of Manufacturing Equipment (GEM) | |
| SEMI E33 | Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility | |
| SEMI E37 | High-Speed SECS Message Services (HSMS) Generic Services | |
| SEMI E43 | Guide for Measuring Static Charge on Objects and Surfaces. | |
| SEMI E5 | SEMI Equipment Communications Standard 2 Message Content (SECS-II) | |
| SEMI E51 | Guide for Typical Facilities Services and Termination Matrix | |
| SEMI E54 | Specification for Sensor/Actuator Network | |
| SEMI E58 | Specification for Automated Reliability, Availability, and Maintainability (ARAMS) | |
| SEMI E6 | Guide for Semiconductor Equipment installation Documention | |
| SEMI E78 | Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment |
|
| SEMI S2 | Environmental, Health, and Safety Guidline for Semiconductor Manufacturing Equipment | |
| SEMI S23 | Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment |
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